Method for preparing gold-phase section samples aiming at embedded printed-circuit board

The invention aims at an embedded printed-circuit board and provides a method for preparing gold-phase section samples. The method comprises the following steps of attaching the embedded printed-circuit board to be detected on the surface of a strengthening support board, and successively cutting samples, sealing glue and carrying out cast pouring, analyzing samples by a gold phase, grinding, polishing, and carrying out microetching and other processes to obtain the gold-phase section samples. The method provided by the invention has the advantages that the problems that the samples are directly cut to result in deformation of the section samples, bending of the section samples in the glue sealing and cast pouring process, and easily excessive grinding in the grinding process and other problems in a preparation process of the gold-phase section samples of the burying embedded printed-circuit board are solved, the stability and the consistency of the gold-phase section samples are guaranteed, the detection cos