Prepreg curing process of epoxy resin

The invention relates to a prepreg curing process of epoxy resin, belonging to the technical field of a composite material process. The preparation method of the epoxy resin comprises the following steps: (A), preparing E-54 resin with JF45 resin in a weight ratio of 1:1 to form mixed resin; (B), ad...

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Bibliographische Detailangaben
Hauptverfasser:	WAN JIANPING, HU JIANDONG, GAO XIANG, WAN YINGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	The invention relates to a prepreg curing process of epoxy resin, belonging to the technical field of a composite material process. The preparation method of the epoxy resin comprises the following steps: (A), preparing E-54 resin with JF45 resin in a weight ratio of 1:1 to form mixed resin; (B), adding dapsone which accounts for 40%-50% of the weight of the mixed resin in the step (A); (C), adding boron trifluoride monoethylamine which accounts for 1%-3% of the weight of the mixed resin in the step (A) and mixing to obtain epoxy resin; and (D), curing the epoxy resin prepared in the step, wherein curing parameters are as follows: a curing temperature of the epoxy resin is 135 DEG C-185 DEG C, curing time is 28 minutes-119 minutes, gelation time is 120 DEG C-170 DEG C, time for starting wire-drawing is 8 minutes-97 minutes, and time for terminating wire-drawing is 13.5 minutes-216 minutes. The epoxy resin disclosed by the invention adopts mixed epoxy resin, is stable in process performance, easily engineered,