Cleaning lead-frames to improve wirebonding process
A method of processing a semiconductor substrate to remove undesired material therefrom or to prepare a surface of the semiconductor substrate for subsequent bonding wherein the substrate comprises a leadframe comprising dies, bond pads, contacts, and wires, the method comprises the step of contacti...
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| Hauptverfasser: | , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A method of processing a semiconductor substrate to remove undesired material therefrom or to prepare a surface of the semiconductor substrate for subsequent bonding wherein the substrate comprises a leadframe comprising dies, bond pads, contacts, and wires, the method comprises the step of contacting the substrate with a liquid cleaning composition and compositions useful in the method. |
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