Method for achieving eutectic soldering of chips

The invention provides a method for achieving eutectic soldering of chips. The method comprises the steps of a, compressible areas in the chips are determined, and a photoetching mask panel is manufactured; b, conducting adhesives in the compressible areas of the chips are removed through a photoetching develop method on a gilded ceramic wafer; c, ball points, used as protruding points, are planted at the position, where the adhesives are removed, on the ceramic wafer through a gold ball bonding method; d, the ceramic wafer is cut into small ceramic wafers consistent with the chips in size through a gear cutting method; e, a tool locating clamp is manufactured according to the shapes of cavities to be welded, and a small ceramic wafer pressing block clamp with gold protruding points makes contact with non-circuit areas of the chips through the protruding points; f, a pressing block is arranged on the small ceramic wafer pressing block clamp, and vacuum compressible soldering of the chips is indirectly achieve