Lead-free solder composition for glass

The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt% to about 60 wt%. The zinc (Zn) ranges from about 0.01 wt% to about 11.0 wt%. The tin (Sn) is included as a re...

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Bibliographische Detailangaben
Hauptverfasser:	LEE JOO-DONG, PARK HYUN-DAL, KIM SEUNG-KYU, BAK MIN-HO, JOO HONG-NHO, LEE TAE-SEUNG, JUNG HYUNAE, JEONG HAE-WON, YOON HO-JUNE, LEE SU-MYUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt% to about 60 wt%. The zinc (Zn) ranges from about 0.01 wt% to about 11.0 wt%. The tin (Sn) is included as a remaining component.