Printed circuit board manufacturing method

A printed circuit board manufacturing method is provided to reduce a copper plating thickness deviation by processing light exposure and copper plating on only one side without removing a release paper of the other side. CONSTITUTION: A developing solution is permeated into a PTH(Plated Through Hole). A dry film coated on the other side is removed(S50). Electric copper plating is performed on a double-sided flexible copper foil laminating plate(S60). The dry film and a release paper on both sides of the flexible copper foil laminating plate are peeled(S70). A circuit is formed on the flexible copper foil laminating plate(S80). [Reference numerals] (AA) Start; (BB) End; (S10) 1st process processing a PTH; (S20) 2nd process performing an electroless copper plating; (S30) 3rd process coating a dry film and release paper; (S40) 4th process performing an exposure process; (S50) 5th process penetrating a developing solution and removing a dry film on the other side; (S60) 6th process performing an electric copper p