Novel through hole chain testing structure and testing method thereof

The invention relates to a novel through hole chain testing structure which comprises lamination layers formed by a plurality of metal layers. Through holes are formed in adjacent metal layers, a top metal layer is located on the lamination layers, and the top metal layer is connected with the lamin...

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1. Verfasser: PENG BINGQING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a novel through hole chain testing structure which comprises lamination layers formed by a plurality of metal layers. Through holes are formed in adjacent metal layers, a top metal layer is located on the lamination layers, and the top metal layer is connected with the lamination layers through the through holes. All the metal layers are arranged in a step shape in an interlaced mode, or a through hole chain is arranged in a serpentine bend mode, so that simultaneous detection of the lamination layers and the metal layers and the through holes in the top metal layer can be achieved. The through hole chain can reflect the performance of components in a back-end process more accurately, the combined through hole chain is not limited to detection of single-layer through hole performance, can further achieve detection of multilayer through hole chains, and the through hole chain can further select through holes of different layers flexibly to achieve different detections according to need