Curable heat-dissipating composition

The present invention relates to a curable heat-dissipating composition comprising (A) a urethane resin having a carboxyl group and produced by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol compound and (c) a dihydroxy compound having a carboxyl group together, (B) an epoxy resin...

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Bibliographische Detailangaben
Hauptverfasser:	OTSUKA YUKI, UCHIDA HIROSHI, KODUTSUMI TOSHIHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a curable heat-dissipating composition comprising (A) a urethane resin having a carboxyl group and produced by reacting (a) a polyisocyanate compound, (b) a polycarbonate diol compound and (c) a dihydroxy compound having a carboxyl group together, (B) an epoxy resin and (C) an inorganic filler (excluding barium sulfate and titanium oxide), wherein the content of the inorganic filler (C) is 50-96 mass%. The inorganic filler (C) to be used is preferably a combination of flat-shaped boron nitride and particulate alumina, aluminum nitride or boron nitride. This curable heat-dissipating resin composition has high thermal conductivity, flexibility and good adhesion to metals, and is therefore extremely useful in the fields of power semiconductors, semiconductor elements including optical semiconductors, semiconductor devices, metal plates for circuits, circuits comprising the metal plates, circuit boards, hybrid integrated circuits and so on.