Halogen-free flame-retardant high-glass-transition-temperature phenolic resin hardener and preparation method thereof

A phenolic-type hardener is disclosed, a phosphorus compound is grafted to a phenyl ring and a hydrogen atom at the grafting position is replaced; when the phenolic-type hardener is reacted with epoxy resin and is hardened, a relatively compact crosslinking density and excellent heat resistance are...

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Bibliographische Detailangaben
Hauptverfasser:	FENG DIANRUN, ZHAO JIAZHENG, LIAO DECHAO, CHEN HAOSHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	A phenolic-type hardener is disclosed, a phosphorus compound is grafted to a phenyl ring and a hydrogen atom at the grafting position is replaced; when the phenolic-type hardener is reacted with epoxy resin and is hardened, a relatively compact crosslinking density and excellent heat resistance are provided; the phenolic-type hardener can be used as a halogen-free flame-retardant resin hardener for an insulating layer material of printed circuit boards or a packaging material of semiconductors, so that the insulating layer material of the printed circuit boards or the packaging material of the semiconductors possesses excellent flame retardance and high glass-transition temperature.