Ceramic electronic component and manufacturing method thereof

An objective of the present invention is to increase binding strength of an external terminal electrode of a ceramic electronic component. In addition to making the thickness of a peripheral edge part (8) of an external terminal electrode (7) thicker than a central part (9) thereof, at least a portion of the peripheral edge part (8) is embedded in a component main body (3). It is preferable for the surface (10) of the external terminal electrode (7) and the primary face (6) of the component main body (3) to be positioned in the same plane. It would also be permissible for an electrically insulating covering layer (11) to be formed along the primary face (6) of the component main body (3) such that at least a portion of the peripheral edge part (8) of the external terminal electrode (7) is covered. It is preferable for a terminal part (12) of the covering layer (11) in the primary face (6) of the component main body (3) to contact the thickest part of the peripheral edge part (8) of the external terminal elect