A light emitting diode package and a manufacturing method thereof
The invention discloses a light emitting diode package and a manufacturing method thereof. The light emitting diode package comprises a conducitve support, a reflective cup, a light emitting diode chip, and a lens. The reflective cup is wrapped around the conductive support and forms a recess openin...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The invention discloses a light emitting diode package and a manufacturing method thereof. The light emitting diode package comprises a conducitve support, a reflective cup, a light emitting diode chip, and a lens. The reflective cup is wrapped around the conductive support and forms a recess opening exposed to a part of the surface of the conductive support on a crystalline region. The light emitting diode chip is disposed on the surface of the conductive support in the recess opening. The lens is disposed over the recess opening and is fixed on the surface of the reflective cup. The lens is formed by a domed reticular frame and packaging glue filled in the domed reticular frame. |
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