Semiconductor technology, semiconductor structure and package structure thereof

The invention relates to a semiconductor technology, a semiconductor structure and a package structure thereof. The semiconductor technology comprises the following steps: providing a carrier, wherein the carrier has a metal layer, and the metal layer has a plurality of substrate areas and a plurality of lateral areas; forming a first photoresist layer; forming a plurality of bearing parts; removing the first photoresist layer to expose the bearing parts, wherein each bearing part has a bearing surface, and each bearing surface has a first area and a second area; forming a second photoresist layer which exposes the first areas of the bearing surfaces; forming a plurality of joint parts, wherein the joint parts cover the first areas of the bearing surfaces so that the joint parts are enabled to be connected with the bearing parts to form snap bumps; removing the second photoresist layer to expose the snap bumps; and removing the lateral areas of the metal layer to enable a plurality of under-bump metal layers