Resin molding equipment and resin molding method

The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the wo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WADA KAZURO, NAKAJIMA KENJI, MIYAJIMA FUMIO, GOTOH NAOYA, MAKINO HARUHISA, TAKAHASHI HARUHISA, KOBAYASHI KAZUHIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.