Method for measuring residual stress in TSV copper column
The invention relates to the field of microelectronics, and discloses a method for measuring residual stress in a TSV copper column. The method comprises: determining a test origin point on the surface of a TSV cooper column requiring test; respectively preparing a set of the same micro labels in th...
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| creator | WANG JUN XIAO FEI ZHANG ZHAOQIANG ZHAI XINDUO |
| description | The invention relates to the field of microelectronics, and discloses a method for measuring residual stress in a TSV copper column. The method comprises: determining a test origin point on the surface of a TSV cooper column requiring test; respectively preparing a set of the same micro labels in three directions of the test origin point, wherein position relationships between the three sets of the micro labels and the test origin point are the same; perforating a micro hole on the test origin point position; detecting position changes of the three sets of the micro labels before and after perforating the micro hole; and calculating the residual stress of the test origin point through combining elasticity according to the position changes of the three sets of the micro labels. With the present invention, the test on the residual stress in the TSV copper column does not require a strain gage, and further does not require determination on roughness of the sample TSV copper column so as to reduce test requiremen |
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The method comprises: determining a test origin point on the surface of a TSV cooper column requiring test; respectively preparing a set of the same micro labels in three directions of the test origin point, wherein position relationships between the three sets of the micro labels and the test origin point are the same; perforating a micro hole on the test origin point position; detecting position changes of the three sets of the micro labels before and after perforating the micro hole; and calculating the residual stress of the test origin point through combining elasticity according to the position changes of the three sets of the micro labels. 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The method comprises: determining a test origin point on the surface of a TSV cooper column requiring test; respectively preparing a set of the same micro labels in three directions of the test origin point, wherein position relationships between the three sets of the micro labels and the test origin point are the same; perforating a micro hole on the test origin point position; detecting position changes of the three sets of the micro labels before and after perforating the micro hole; and calculating the residual stress of the test origin point through combining elasticity according to the position changes of the three sets of the micro labels. 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The method comprises: determining a test origin point on the surface of a TSV cooper column requiring test; respectively preparing a set of the same micro labels in three directions of the test origin point, wherein position relationships between the three sets of the micro labels and the test origin point are the same; perforating a micro hole on the test origin point position; detecting position changes of the three sets of the micro labels before and after perforating the micro hole; and calculating the residual stress of the test origin point through combining elasticity according to the position changes of the three sets of the micro labels. With the present invention, the test on the residual stress in the TSV copper column does not require a strain gage, and further does not require determination on roughness of the sample TSV copper column so as to reduce test requiremen</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS TESTING |
| title | Method for measuring residual stress in TSV copper column |
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