Pressure unit

Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SASUGA ICHIRO, TSURUGAI KENGO, MASUDA MICHIYA, KATO NOBUHARU, TAKAMURA NORITOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	Provided is a pressure unit with which it is possible to absorb deviations in dimensions when manufacturing an object to be pressured, and to achieve greater thinness with a simple configuration. The pressure unit pressures a semiconductor layer unit wherein semiconductor element modules and coolant pipes which make contact with the semiconductor element modules and cool the semiconductor element modules are alternately stacked. The pressure unit comprises: a spring member wherein a wire material is wound into a coil shape, a pitch angle whereof changing periodically; and a housing member, whereto the end parts of the spring member are attached.