Wire saw

A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIMADA HITOSHI, KAWATSU TOMOYUKI, YABU YOSUKE, TANIZAKI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BROACHING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SEMICONDUCTOR DEVICES SHEARING SLOTTING TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	A wire (12) is wound around multiple processing rollers (11) several times. A holding mechanism (13) and a depressing mechanism (25) are provided above an area where the wire (12) is wound. The holding mechanism (13) holds a workpiece (W) elastically and laterally. The depressing mechanism (25) depresses the workpiece (W) held by the holding mechanism (13) toward the wire (12).