Electronic module and method for manufacturing electronic module

An object of this invention is to provide an Electronic Module that can be manufactured easily with a simple configuration and that can constitute various different variation groups with ease and at a low price. The Electronic Module comprises a body case 2 that comprises a plurality of case members 3, 4 by abutting each other and that has an internal space (S) where a first opening P1 is formed on one side surface of the internal space (S) and a second opening P2 that opens in a direction different from that of the first opening P1 is in an exposed state when a plurality of the case members 3, 4 are separated each other, a substrate 5 on which a sensor IC 51 is mounted and that is housed in the internal space (S) of the body case 2, and a resin body 6 that covers the substrate 5 by being filled in the internal space (S) of the body case 2 and solidified or hardened, and is characterized by that a plurality of the case members 3, 4 and the substrate 5 are integrated by the use of the resin body 6 as an accoup