Laminated LED light emitting module and manufacturing method
A laminated LED light emitting module comprises an upper layer package and a lower layer package, wherein the upper layer package comprises an LED package and an upper substrate; a through hole is formed in the upper substrate; a metal layer is arranged on the surface of the upper substrate; the low...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A laminated LED light emitting module comprises an upper layer package and a lower layer package, wherein the upper layer package comprises an LED package and an upper substrate; a through hole is formed in the upper substrate; a metal layer is arranged on the surface of the upper substrate; the lower layer package comprises a lower substrate and a circuit component; the circuit component is fixed on the lower substrate; a metal layer is arranged on the upper surface of the lower substrate; a blind hole is formed in the lower substrate; and a soldering tin layer is arranged between the through hole and the blind hole. The invention further provides a method for manufacturing the LED light emitting module. By the aid of a welding ball positioning function, a mechanical self-aligning method for the upper substrate and the lower substrate is realized, the cost and the size are reduced; an aligning method in a horizontal direction is simplified; besides, a temperature detection function and an optical detection f |
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