Lead frame, semiconductor package, and manufacturing method of the same

The invention provides a lead frame capable of improving the connection reliability to a substrate, a semiconductor package with the lead frame, and a manufacturing method of the same. The semiconductor package comprises: a lead frame including a chip mounting portion and a terminal portion as external connection terminal; a semiconductor chip, which is mounted on the chip mounting portion and electrically connected to the terminal portion; a through groove penetrating the terminal portion from one surface on a side of the semiconductor chip to another surface in a thickness direction of the terminal portion; a lid portion covering an end portion of the through groove on the side of the semiconductor chip; and a resin portion sealing the semiconductor chip, wherein the another surface of the terminal portion and a side surface of the terminal portion facing an outside of the semiconductor package are coated by a plating film.