Heat-conductive film and production method therefor

A heat-conductive film (10) comprises: a substrate (12) composed of resin; and a scaly filler (14) dispersed in the substrate (12). The scaly filler (14) contains a scaly filler body (16) composed of boron nitride and a coat of -ferrite (18) coating the filler body (16), and orients in the thickness...

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Bibliographische Detailangaben
Hauptverfasser:	YONETAKE KOICHIRO, TAKAYAMA YOSHINARI, TAKAHASHI TATSUHIRO, AWANO HIROSHI, KITAGAWA DAISUKE, SHOJI TAKUMI, TAGAWA KENICHI, TADA MITSUTERU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A heat-conductive film (10) comprises: a substrate (12) composed of resin; and a scaly filler (14) dispersed in the substrate (12). The scaly filler (14) contains a scaly filler body (16) composed of boron nitride and a coat of -ferrite (18) coating the filler body (16), and orients in the thickness direction of the heat-conductive film (10). The resin is, for example, polyimide.