Thin-layer fluid type low-stress polishing device

The invention discloses a thin-layer fluid type low-stress polishing device and belongs to the field of ultra-precise optical surface machining. The device comprises a sealed working chamber, a rotary table, an anode plate, an anode probe, a cathode platform, a workpiece, a first duct, a booster pump, a lifting platform, a second duct, a moulding nozzle, a liquid collection device and the like. During working, the workpiece is fixed on the rotary table, an electric field is produced between the anode plate or the anode probe and the cathode platform, an electrorheological polishing liquid is mixed uniformly, then is boosted by the booster pump and flows into the liquid collection device through the first duct and the second duct, under the action of pressure, the liquid flows into a thin-layer area through the moulding nozzle, and under the action of the flowing power and the shearing force, surface material removing is achieved. According to the thin-layer fluid type low-stress polishing device, the problem