Method of fabricating a semiconductor device and semiconductor production apparatus
An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including curving a semiconductor substrate onto which a protection tape is bonded, and removing the protection tape in a state where the semiconductor substrate is curved.
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including curving a semiconductor substrate onto which a protection tape is bonded, and removing the protection tape in a state where the semiconductor substrate is curved. |
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