LED chip with side electrodes and package structure of LED chip

The invention provides an LED chip with side electrodes. The LED chip comprises a substrate, an N-type layer, a luminous layer, a P-type layer, an N electrode and a P electrode. The N-type layer is arranged on the substrate, the N electrode is conductively connected with the N-type layer, the P elec...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG DONGLEI, ZHUANG CANYANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides an LED chip with side electrodes. The LED chip comprises a substrate, an N-type layer, a luminous layer, a P-type layer, an N electrode and a P electrode. The N-type layer is arranged on the substrate, the N electrode is conductively connected with the N-type layer, the P electrode is conductively connected with the P-type layer, one end of the N electrode extends to one side surface of the substrate along a side surface of the N-type layer, an insulating layer is arranged on a side surface of the P-type layer, a corresponding side surface of the luminous layer and a corresponding side surface of the N-type layer, and one end of the P electrode extends to the other side surface of the substrate along a side surface of the insulating layer. The LED chip has the advantages that light rays can be emitted from both the upper surface and the lower surface of the LED chip, and accordingly the luminous efficiency of the LED chip is greatly improved.