Hot melt adhesive containing modified attapulgite and preparation method thereof
The invention discloses hot melt adhesive containing modified attapulgite. The hot melt adhesive is prepared from the following components in parts by weight: 80-90 parts of EEA (eval ethylenevinyl alcohol), 10-15 parts of APAO (amorphous poly alpha olefin) ethylene-propylene-1-butene polymer, 10-12...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses hot melt adhesive containing modified attapulgite. The hot melt adhesive is prepared from the following components in parts by weight: 80-90 parts of EEA (eval ethylenevinyl alcohol), 10-15 parts of APAO (amorphous poly alpha olefin) ethylene-propylene-1-butene polymer, 10-12 parts of epichlorohydrin rubber H75 tackifying resin, 1-2 parts of ethylene bis stearamide, 10-12 parts of modified attapulgite, 0.1-0.3 part of antioxidant 2246, 0.1-0.2 part of antioxidant DMTDP (thiodipropionate bi-tetradecyl ester), 0.2-0.3 part of antioxidant TNPP (tri-nonyl phenyl ester phosphate), 10-11 parts of acetyl triethyl citrate, and 2-3 parts of trioctyl trimellitate. The preparation method comprises the steps of: firstly preparing the epichlorohydrin rubber H75 tackifying resin, then mixing with other materials, extruding through an extruder, cooling and pelletizing. The hot melt adhesive disclosed by the invention is strong in caking property; and homemade rubber viscosity resin is added to the fo |
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