High-temperature oxidization equipment

The invention relates to the field of micro-electronics manufacturing, in particular to high-temperature oxidization equipment. The high-temperature oxidization equipment comprises a vertical barrel-shaped wafer boat, wherein a plurality of frustum-shaped supporting rings for placing wafers are arranged in the wafer boat, and the radiuses of the frustum-shaped supporting rings are gradually increased from top to bottom; and the slope of each supporting ring and the inner wall of the wafer boat form an inclination angle alpha. When a high-temperature oxidization technology is performed, reaction gas is fed into the wafer boat; the supporting rings are provided with the slopes, so that the reaction gas can be more easily fed into the center positions of the wafer surfaces, and the gas reaction concentration difference between the edge position and the center position on the upper surface of each wafer is reduced; and therefore, a layer of oxidized film with more uniform thickness grows on the surface of each wa