Hot-pressing device for anisotropic conductive adhesive in back bonding equipment
The invention discloses a hot-pressing device for anisotropic conductive adhesive in back bonding equipment, which is used for carrying out hot pressing on the conductive adhesive in the back bonding equipment. The hot-pressing device is characterized by comprising a pressing head component (2), a g...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a hot-pressing device for anisotropic conductive adhesive in back bonding equipment, which is used for carrying out hot pressing on the conductive adhesive in the back bonding equipment. The hot-pressing device is characterized by comprising a pressing head component (2), a guiding component (1) and a driving component (5), wherein the pressing head component (2) is used for carrying out hot pressing on the conductive adhesive; the guiding component (1) is arranged on a supporting base (4); the pressing head component (2) is arranged on the guiding component (1), and carries out guiding movement to finish hot pressing by the guiding component (1); and the driving component (5) is arranged at one side of the guiding component (1) and is used for driving the guiding component (1) to do linear movement so as to realize guiding movement of the pressing head component (2). The hot-pressing device disclosed by the invention has the advantages that the hot-pressing process in a hot-pressing p |
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