Hot-pressing device for anisotropic conductive adhesive in back bonding equipment

The invention discloses a hot-pressing device for anisotropic conductive adhesive in back bonding equipment, which is used for carrying out hot pressing on the conductive adhesive in the back bonding equipment. The hot-pressing device is characterized by comprising a pressing head component (2), a g...

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Bibliographische Detailangaben
Hauptverfasser: CHENG XIAOMING, PAN WEIJIN, FENG MENGDAN, XUE TIANCHENG, TAO BO, LUO CHONG, ZHOU PENG, HONG YANG, HU YUE, ZHANG YANG, TANG PENGPENG, ZHU QINMIAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a hot-pressing device for anisotropic conductive adhesive in back bonding equipment, which is used for carrying out hot pressing on the conductive adhesive in the back bonding equipment. The hot-pressing device is characterized by comprising a pressing head component (2), a guiding component (1) and a driving component (5), wherein the pressing head component (2) is used for carrying out hot pressing on the conductive adhesive; the guiding component (1) is arranged on a supporting base (4); the pressing head component (2) is arranged on the guiding component (1), and carries out guiding movement to finish hot pressing by the guiding component (1); and the driving component (5) is arranged at one side of the guiding component (1) and is used for driving the guiding component (1) to do linear movement so as to realize guiding movement of the pressing head component (2). The hot-pressing device disclosed by the invention has the advantages that the hot-pressing process in a hot-pressing p