Polycrystalline diamond cutting element

A polycrystalline-diamond cutting clement (50) is disclosed for a drill bit of a downhole tool. The cutting element (50) includes a substrate (24) and a diamond table bonded to the substrate (24). The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment (...

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Bibliographische Detailangaben
Hauptverfasser:	SUE JIINJEN ALBERT, G ZHAN, SETLUR DEEPTHI RAJ, HUGHES MICHAEL D, SRESHTA HAROLD A, FRANCIS MARK JONATHAN, GILLEYLEN RUSSELL C
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASTING CHEMISTRY EARTH DRILLING EARTH DRILLING, e.g. DEEP DRILLING FERROUS OR NON-FERROUS ALLOYS FIXED CONSTRUCTIONS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MINING OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR ASLURRY OF MINERALS FROM WELLS PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	A polycrystalline-diamond cutting clement (50) is disclosed for a drill bit of a downhole tool. The cutting element (50) includes a substrate (24) and a diamond table bonded to the substrate (24). The diamond table includes a diamond filler with at least one leached polycrystalline diamond segment (54) packed therein along at least one working surface thereof. The cutting element (50) may be formed by positioning the diamond table on the substrate (24) and bonding the diamond table onto the substrate (24) such that the polycrystalline diamond segment (54) is positioned along at least one working surface of the diamond table. A spark plasma sintering or double press operation may be used to bond the diamond table onto the substrate (24).