Device for preparing structural adhesive films

The invention relates to a device for preparing structural adhesive films, and aims at solving the problems that in the prior art the working space is large, the cost is high and the working efficiency is low as the work of preparing carrier-free adhesive films, isotopic carrier adhesive films and c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: QU CHUNYAN, SU KAI, YANG HAIDONG, LI GONGCHUN, MAO YONG, WANG HAIMIN, FENG HAO, WANG DEZHI, ZHANG YANG, LI HONGFENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a device for preparing structural adhesive films, and aims at solving the problems that in the prior art the working space is large, the cost is high and the working efficiency is low as the work of preparing carrier-free adhesive films, isotopic carrier adhesive films and carrier adhesive films is accomplished through two machines, deviation occurs to thickness precision when the carrier adhesive films are prepared, and fiber beams cannot be sufficiently dipped in an adhesive matrix when adhesive films which take fiber fabric as the carrier are prepared. The device comprises a first frame mechanism, a second frame mechanism, a first tension mechanism, an extrusion rolling mechanism, a first rotating shaft mechanism, a second rotating mechanism, a thermal roller mechanism, a third rotating mechanism, a cutter, a winding roller component, a cooling roller, a second tension mechanism, a third tension mechanism, a cooling roller mechanism, three coiling shaft mechanisms, two power output