Welding substrate for electronic product and manufacturing method of welding substrate

The invention discloses a welding substrate for an electronic product. The welding substrate comprises a base plate, wherein the base plate is provided with a metallized graph layer, the metallized graph layer is provided with a gold-tin film layer, a barrier layer is arranged between the gold-tin film layer and the metallized graph layer and is a single metal film layer or a composite metal film layer, and the gold-tin film layer is a gold-tin alloy layer or is of a multi-layer structure formed by alternately compounding gold layers and tin layers. With the adoption of the film substrate, the graph line accuracy is high, the surface smoothness of the film layer is good, a chip can be directly welded and located without needing to precasting solders, the installation and locating accuracy of the chip can be ensured, and the film substrate is suitable for photoelectric products of high-power LED (light-Emitting Diode) optical communication and the like. Meanwhile, according to the film substrate disclosed by t