Wire tool
A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).
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Format: | Patent |
Sprache: | chi ; eng |
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Online-Zugang: | Volltext bestellen |
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Zusammenfassung: | A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P). |
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