Wire tool

A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).

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Bibliographische Detailangaben
Hauptverfasser: WEN HUANJUN, LIU MINHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wire tool includes a wire including a metal, a plating layer disposed on a surface of the wire, a plurality of diamond particles disposed over the plating layer, and a protection layer each covering the diamond particles and including phosphorus (P).