Printed circuit board laid with differential pairs
A printed circuit board laid with differential pairs comprises an outer signal layer, an inner signal layer, a first earthing reference layer and a second earthing reference layer, wherein the first earthing reference layer is located between the outer signal layer and the inner signal layer; the fi...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A printed circuit board laid with differential pairs comprises an outer signal layer, an inner signal layer, a first earthing reference layer and a second earthing reference layer, wherein the first earthing reference layer is located between the outer signal layer and the inner signal layer; the first earthing reference layer and the second earthing reference layer are located on the two sides of the inner signal layer; a first mixed differential pair and a second mixed differential pair that are parallel to each other are laid on the outer signal layer and the inner signal layer; the distance between the inner signal layer and the first earthing reference layer is h1; the distance between the outer signal layer and the second earthing reference layer is h2; h is equal to the smaller one between h1 and h2; and the distance between the first mixed differential pair and the second mixed differential pair is less than or equal to 3 times of h. |
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