Chip classification method
The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposit...
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| creator | XU CHENKE CAI MEILING OU ZHEN JI LIANGSHENG LIN XUZHEN SU WENZHENG LIU YILONG CHEN JUNCHANG |
| description | The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposite to the first surface; attaching the multiple chips to the second surface; weakening attachment force between the multiple chips and the first surface; and separating the multiple chips from the first surface after the attachment force between the multiple chips and the first surface weakens. |
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The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposite to the first surface; attaching the multiple chips to the second surface; weakening attachment force between the multiple chips and the first surface; and separating the multiple chips from the first surface after the attachment force between the multiple chips and the first surface weakens.</description><language>chi ; eng</language><subject>PERFORMING OPERATIONS ; POSTAL SORTING ; SEPARATING SOLIDS FROM SOLIDS ; SORTING ; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING ; TRANSPORTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130626&DB=EPODOC&CC=CN&NR=103170461A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130626&DB=EPODOC&CC=CN&NR=103170461A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>XU CHENKE</creatorcontrib><creatorcontrib>CAI MEILING</creatorcontrib><creatorcontrib>OU ZHEN</creatorcontrib><creatorcontrib>JI LIANGSHENG</creatorcontrib><creatorcontrib>LIN XUZHEN</creatorcontrib><creatorcontrib>SU WENZHENG</creatorcontrib><creatorcontrib>LIU YILONG</creatorcontrib><creatorcontrib>CHEN JUNCHANG</creatorcontrib><title>Chip classification method</title><description>The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposite to the first surface; attaching the multiple chips to the second surface; weakening attachment force between the multiple chips and the first surface; and separating the multiple chips from the first surface after the attachment force between the multiple chips and the first surface weakens.</description><subject>PERFORMING OPERATIONS</subject><subject>POSTAL SORTING</subject><subject>SEPARATING SOLIDS FROM SOLIDS</subject><subject>SORTING</subject><subject>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJByzsgsUEjOSSwuzkzLTE4syczPU8hNLcnIT-FhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGxobmBiZmho7GxKgBAEywIwA</recordid><startdate>20130626</startdate><enddate>20130626</enddate><creator>XU CHENKE</creator><creator>CAI MEILING</creator><creator>OU ZHEN</creator><creator>JI LIANGSHENG</creator><creator>LIN XUZHEN</creator><creator>SU WENZHENG</creator><creator>LIU YILONG</creator><creator>CHEN JUNCHANG</creator><scope>EVB</scope></search><sort><creationdate>20130626</creationdate><title>Chip classification method</title><author>XU CHENKE ; CAI MEILING ; OU ZHEN ; JI LIANGSHENG ; LIN XUZHEN ; SU WENZHENG ; LIU YILONG ; CHEN JUNCHANG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN103170461A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>PERFORMING OPERATIONS</topic><topic>POSTAL SORTING</topic><topic>SEPARATING SOLIDS FROM SOLIDS</topic><topic>SORTING</topic><topic>SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>XU CHENKE</creatorcontrib><creatorcontrib>CAI MEILING</creatorcontrib><creatorcontrib>OU ZHEN</creatorcontrib><creatorcontrib>JI LIANGSHENG</creatorcontrib><creatorcontrib>LIN XUZHEN</creatorcontrib><creatorcontrib>SU WENZHENG</creatorcontrib><creatorcontrib>LIU YILONG</creatorcontrib><creatorcontrib>CHEN JUNCHANG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>XU CHENKE</au><au>CAI MEILING</au><au>OU ZHEN</au><au>JI LIANGSHENG</au><au>LIN XUZHEN</au><au>SU WENZHENG</au><au>LIU YILONG</au><au>CHEN JUNCHANG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip classification method</title><date>2013-06-26</date><risdate>2013</risdate><abstract>The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposite to the first surface; attaching the multiple chips to the second surface; weakening attachment force between the multiple chips and the first surface; and separating the multiple chips from the first surface after the attachment force between the multiple chips and the first surface weakens.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | PERFORMING OPERATIONS POSTAL SORTING SEPARATING SOLIDS FROM SOLIDS SORTING SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING TRANSPORTING |
| title | Chip classification method |
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