Chip classification method

Chip classification method

The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposit...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: XU CHENKE, CAI MEILING, OU ZHEN, JI LIANGSHENG, LIN XUZHEN, SU WENZHENG, LIU YILONG, CHEN JUNCHANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
PERFORMING OPERATIONS
POSTAL SORTING
SEPARATING SOLIDS FROM SOLIDS
SORTING
SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTEDPIECE-MEAL, e.g. BY PICKING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a chip classification method. The chip classification method comprises the following steps of: providing a chip bearing part comprising a first surface; providing multiple chips on the first surface; providing a chip receiving part comprising a second surface which is opposite to the first surface; attaching the multiple chips to the second surface; weakening attachment force between the multiple chips and the first surface; and separating the multiple chips from the first surface after the attachment force between the multiple chips and the first surface weakens.