Method of detecting normality of wafer
The invention discloses a method of detecting normality of a wafer. The method of detecting normality of the wafer includes the following steps. Mark positions which correspond to each other are respectively arranged on all to-be-detected wafers. Data of the corresponding mark positions are theoreti...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method of detecting normality of a wafer. The method of detecting normality of the wafer includes the following steps. Mark positions which correspond to each other are respectively arranged on all to-be-detected wafers. Data of the corresponding mark positions are theoretically maximum values of detected data of the wafers. Multiple positions which correspond one by one can be additionally arranged on the to-be-detected wafers, apart from the mark positions. Data of the set mark positions and other multiple positions of all the wafers and collected and recorded. Data collected from all the wafers are averaged and the average of all the wafers is obtained. The difference between the datum of the mark position of each wafer and the average of the wafer is obtained and judged to be within a preset range or not. If not, the wafer is normal and if yes, the wafer is not normal. The method of detecting normality of the wafer can effectively detect abnormal wafers so as to avoid large loss. |
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