Low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and preparation method thereof

The invention provides low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The method comprises the following steps of: mixing high viscosity and low viscosity of vinyl polydimethylsiloxane; adding aluminum oxide with particle size of 1-5...

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Bibliographische Detailangaben
Hauptverfasser:	CHEN JIANYI, HU XINSONG, LUO WEI, HE ZONGYE, LIN SHIKAI, CHEN YAOGEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides low-viscosity high-heat-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The method comprises the following steps of: mixing high viscosity and low viscosity of vinyl polydimethylsiloxane; adding aluminum oxide with particle size of 1-5 microns as heat conduction filler; further adding a compound coupling agent formed by combining aluminic acid ester, KH570 (gamma-methylacryloyloxypropyl trimethoxysilane) and KH550 (gamma-aminopropyl triethoxysilane) and a compound flame retardant formed by combining melamine cyanurate and aluminum hydroxide into a base material system; and preparing the electronic pouring sealant according to a proper proportion. The prepared pouring sealant has high heat conductivity up to 2.5-3.0W.m.K, low viscosity of 2000-3000mPa.s, perfect fluidity and good flame retardance effect; and the production cost is low.