Three-dimensional soft tactile sensor array
The invention belongs to the preparation technique of sensors and provides a three-dimensional soft tactile sensor array which comprises a microstructure which is arrayed in an ordered arrangement and a wire which is located between the end points of the microstructures. Non-conducting rubber is put...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the preparation technique of sensors and provides a three-dimensional soft tactile sensor array which comprises a microstructure which is arrayed in an ordered arrangement and a wire which is located between the end points of the microstructures. Non-conducting rubber is put between the microstructures. Each microstructure is composed of three pillar-shaped bodies, wherein the first pillar-shaped body is placed vertically; the upper end face of the second pillar-shaped body is intersected and connected fixedly with the side face of the first pillar-shaped body. The center of the upper end face of each microstructure and the center of the lower end face of each microstructure are respectively provided with an electric contact. A wire is connected between the electric contacts of the upper end face of the first pillar-shaped body of each microstructure, a wire is connected between the electric contacts of the upper end face of the third pillar-shaped body of each microstructure, a wire |
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