Sputtering target with warning function

The present invention provides a sputtering target with a warning function. The sputtering target comprises: a target body having a bonding surface, a backing body bonded with the target body, and at least a warning body buried in the target body, wherein a projection area of every warning body on t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN RONGSHENG, LU MINGCHANG, SU BAIYING, HU SHUHUA, YIN XINCHUN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a sputtering target with a warning function. The sputtering target comprises: a target body having a bonding surface, a backing body bonded with the target body, and at least a warning body buried in the target body, wherein a projection area of every warning body on the bonding surface is less than or equal to 1% of the total area of the bonding surface, the sum of the projection areas of all the warning body on the bonding surface is less than or equal to 20% of the total area of the bonding surface, a long edge length of every warning body is more than 1 cm, and the warning body comprises a heterogeneous material capable of diffusing different gas molecules in a sputtering environment so as to be adopted as a warning signal. According to the present invention, the projection area of the warning body on the bonding surface is controlled so as to ensure bonding quality and heat elimination function of the sputtering target.