System and method for preparing micro-pore array through femtosecond laser direct writing

Bibliographische Detailangaben

Hauptverfasser:	WANG HUITIAN, LI YONGNAN, TU CHENGHOU, LOU KAI, QIAN SHENGXIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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