Method and apparatus for out-of-autoclave adhesive shear bonding of structures
The shear bonding method of the present application is configured to facilitate bonding of structures in an out-of-autoclave environment. The shear bonding method is configured to bond a plurality of frame members to the interior of a tapered tailboom (103). The frames (113a-113f) are located on a b...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The shear bonding method of the present application is configured to facilitate bonding of structures in an out-of-autoclave environment. The shear bonding method is configured to bond a plurality of frame members to the interior of a tapered tailboom (103). The frames (113a-113f) are located on a bayonet type tool (701). An adhesive pack (501) having a plurality of adhesive film layers is applied to each frame. The bayonet type tool (701) is inserted into the tailboom until the adhesive packs (501) come into contact with the interior walls of the tailboom. Conductive heating tiles (317a-317d) are applied to the exterior of the tailboom. The conductive heating tiles are controlled to first achieve and maintain viscosity of the adhesive packs. During this period the bayonet tool (701) is actuated so that the frames (113) are translated in relation to the tailboom. The heating tiles (317) are then controlled to achieve and maintain the adhesive at a requisite curing temperature. |
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