In-die ultrathin soldering aid sheet rivet punching structure

The invention relates to an in-die ultrathin soldering aid sheet rivet punching structure. Different punching heads and lower female dies are arranged at a station for pressing an ultrathin soldering aid sheet into a base material in the first process of a die, a station for riveting the ultrathin s...

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Bibliographische Detailangaben
Hauptverfasser:	QIN WANTAN, LIU XUEJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL TRANSPORTING WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	The invention relates to an in-die ultrathin soldering aid sheet rivet punching structure. Different punching heads and lower female dies are arranged at a station for pressing an ultrathin soldering aid sheet into a base material in the first process of a die, a station for riveting the ultrathin soldering aid sheet on the base material in the second process of the die and a station for shaping the ultrathin soldering aid sheet riveted on the base material in the third process of the die. By using the in-die ultrathin soldering aid sheet rivet punching structure on a multi-process and multi-station continuous punching die, the ultrathin soldering aid sheets can be automatically pressed into the base material in a large-scale, faster, better and more economic way, the ultrathin soldering aid sheets can be riveted and shaped, and all technical index requirements on ultrathin soldering aid sheet rivet punching for manufacturing fixed contacts are fully satisfied.