Thin metal film transfer material and production method of same
Disclosed is a thin metal film transfer material provided with an insulating metal film which exhibits sufficient electromagnetic wave transmission characteristics and insulation characteristics and exhibits high resistance to corrosion such as oxidation or hydroxylation while maintaining a good met...
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| creator | TANAKA NORIO TSUTSUMIDA YUJI IIJIMA TOSHIKAZU NAKANO SHIGERU |
| description | Disclosed is a thin metal film transfer material provided with an insulating metal film which exhibits sufficient electromagnetic wave transmission characteristics and insulation characteristics and exhibits high resistance to corrosion such as oxidation or hydroxylation while maintaining a good metallic appearance. The thin metal film transfer material is either a material obtained by stacking a resin release layer, a resin protective layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the thickness (X) of the insulating thin metal film layer is 5-100 nm and the total light transmittance (Tr) (%) of the material satisfies the equation Tr >= 87.522 x Exp (-0.0422*X), or is a material obtained by stacking a resin release layer, a resin protective layer, a thin metal film layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the t |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN103003063A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN103003063A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN103003063A3</originalsourceid><addsrcrecordid>eNrjZLAPycjMU8hNLUnMUUjLzMlVKClKzCtOSy1SyE0sSS3KBAon5qUoFBTlp5Qml2Tmg9Vm5Kco5KcpFCfmpvIwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0MDYwMgMjN2NCZGDQB5xjCe</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thin metal film transfer material and production method of same</title><source>esp@cenet</source><creator>TANAKA NORIO ; TSUTSUMIDA YUJI ; IIJIMA TOSHIKAZU ; NAKANO SHIGERU</creator><creatorcontrib>TANAKA NORIO ; TSUTSUMIDA YUJI ; IIJIMA TOSHIKAZU ; NAKANO SHIGERU</creatorcontrib><description>Disclosed is a thin metal film transfer material provided with an insulating metal film which exhibits sufficient electromagnetic wave transmission characteristics and insulation characteristics and exhibits high resistance to corrosion such as oxidation or hydroxylation while maintaining a good metallic appearance. The thin metal film transfer material is either a material obtained by stacking a resin release layer, a resin protective layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the thickness (X) of the insulating thin metal film layer is 5-100 nm and the total light transmittance (Tr) (%) of the material satisfies the equation Tr >= 87.522 x Exp (-0.0422*X), or is a material obtained by stacking a resin release layer, a resin protective layer, a thin metal film layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the t</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130327&DB=EPODOC&CC=CN&NR=103003063A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130327&DB=EPODOC&CC=CN&NR=103003063A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA NORIO</creatorcontrib><creatorcontrib>TSUTSUMIDA YUJI</creatorcontrib><creatorcontrib>IIJIMA TOSHIKAZU</creatorcontrib><creatorcontrib>NAKANO SHIGERU</creatorcontrib><title>Thin metal film transfer material and production method of same</title><description>Disclosed is a thin metal film transfer material provided with an insulating metal film which exhibits sufficient electromagnetic wave transmission characteristics and insulation characteristics and exhibits high resistance to corrosion such as oxidation or hydroxylation while maintaining a good metallic appearance. The thin metal film transfer material is either a material obtained by stacking a resin release layer, a resin protective layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the thickness (X) of the insulating thin metal film layer is 5-100 nm and the total light transmittance (Tr) (%) of the material satisfies the equation Tr >= 87.522 x Exp (-0.0422*X), or is a material obtained by stacking a resin release layer, a resin protective layer, a thin metal film layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the t</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPycjMU8hNLUnMUUjLzMlVKClKzCtOSy1SyE0sSS3KBAon5qUoFBTlp5Qml2Tmg9Vm5Kco5KcpFCfmpvIwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUknhnP0MDYwMgMjN2NCZGDQB5xjCe</recordid><startdate>20130327</startdate><enddate>20130327</enddate><creator>TANAKA NORIO</creator><creator>TSUTSUMIDA YUJI</creator><creator>IIJIMA TOSHIKAZU</creator><creator>NAKANO SHIGERU</creator><scope>EVB</scope></search><sort><creationdate>20130327</creationdate><title>Thin metal film transfer material and production method of same</title><author>TANAKA NORIO ; TSUTSUMIDA YUJI ; IIJIMA TOSHIKAZU ; NAKANO SHIGERU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN103003063A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2013</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA NORIO</creatorcontrib><creatorcontrib>TSUTSUMIDA YUJI</creatorcontrib><creatorcontrib>IIJIMA TOSHIKAZU</creatorcontrib><creatorcontrib>NAKANO SHIGERU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA NORIO</au><au>TSUTSUMIDA YUJI</au><au>IIJIMA TOSHIKAZU</au><au>NAKANO SHIGERU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thin metal film transfer material and production method of same</title><date>2013-03-27</date><risdate>2013</risdate><abstract>Disclosed is a thin metal film transfer material provided with an insulating metal film which exhibits sufficient electromagnetic wave transmission characteristics and insulation characteristics and exhibits high resistance to corrosion such as oxidation or hydroxylation while maintaining a good metallic appearance. The thin metal film transfer material is either a material obtained by stacking a resin release layer, a resin protective layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the thickness (X) of the insulating thin metal film layer is 5-100 nm and the total light transmittance (Tr) (%) of the material satisfies the equation Tr >= 87.522 x Exp (-0.0422*X), or is a material obtained by stacking a resin release layer, a resin protective layer, a thin metal film layer, an insulating thin metal film layer and an adhesive layer in that order on at least one surface of a transparent base film, in which case the t</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES |
| title | Thin metal film transfer material and production method of same |
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