Laser processing machine
The invention relates to a laser processing machine, in particular a laser cutting machine (LM), comprising a work table for receiving a work piece (W) to be processed and a work arm (1) with at least one laser cutting head (2). The laser cutting head (2) comprises a nozzle receiving device (7) and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a laser processing machine, in particular a laser cutting machine (LM), comprising a work table for receiving a work piece (W) to be processed and a work arm (1) with at least one laser cutting head (2). The laser cutting head (2) comprises a nozzle receiving device (7) and a nozzle (D) arranged therein. By means of said nozzle (D) a laser beam (11) maybe directed onto the work piece (W). The machine (LM) also comprises main drives for moving the work arm (1) and/or the laser cutting head (2) in the directions of X-Y-Z axes for processing the work piece (W), as well as an alignment unit for adjusting the laser beam (11). An adjusting station (3) is provided in the effective working region of the main drives of the work arm (1), and comprises a receiving unit (31) for fixing the nozzle (D) and/or the nozzle receiving device (7) during centering of the nozzle (D). The alignment unit has a head element (5B) provided in the laser cutting head (2). The head element (5B)receives the nozzle |
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