Novel bulk molding compound and preparation method thereof

The invention relates to a bulk molding compound composed of the raw materials of: 100 parts of unsaturated polyester resin, 20-100 parts of epoxy resin, 20-60 parts of a low shrinkage modifier, 1-5 parts of an initiator, 0.5-5 parts of a curing accelerator, 60-150 parts of a reinforcing material, 100-250 parts of a filling material, 100-250 parts of a flame retardant, and 30-80 parts of an auxiliary agent. The initiator is an organic peroxide compound. The curing accelerator is epoxy latent accelerator. The flame retardant is hydroxide, and the reinforcing material is glass fiber. The invention has the advantages that: with the bulk molding compound prepared with the method provided by the invention, a manufactured product has the advantages of high mechanical strength, high surface hardness, no halogen, environment friendliness, excellent electrical properties under harsh environments especially hot and humid environments, and the like.