LED (light-emitting diode) daylight lamp packaging module
The invention relates to the field of LEDs (light-emitting diode), and in particular relates to an LED (light-emitting diode) daylight lamp packaging module. The LED daylight lamp packaging module comprises a lamp bead, a heat conduction circuit board and a lens, wherein the lamp bead is directly pa...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to the field of LEDs (light-emitting diode), and in particular relates to an LED (light-emitting diode) daylight lamp packaging module. The LED daylight lamp packaging module comprises a lamp bead, a heat conduction circuit board and a lens, wherein the lamp bead is directly packaged on the heat conduction circuit board through solid phase crystallization, and the lens is covered on the lamp bead and the heat conduction circuit board. By adopting the structure, the production efficiency and product quality of the LED daylight lamp are improved, the original delivery property of an LED chip is ensured, and the service life of an LED fluorescent tube is prolonged. |
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