Polishing apparatus

The present invention provides a polishing apparatus for polishing a periphery of a substrate (W). This polishing apparatus includes a rotary holding mechanism (3) configured to hold the substrate (W) horizontally and rotate the substrate (W), plural polishing head assemblies (1A, 1B, 1C, 1D) provid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KUSA HIROAKI, NAKANISHI MASAYUKI, YAMAGUCHI KENJI, SEKI MASAYA, TAKAHASHI TAMAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a polishing apparatus for polishing a periphery of a substrate (W). This polishing apparatus includes a rotary holding mechanism (3) configured to hold the substrate (W) horizontally and rotate the substrate (W), plural polishing head assemblies (1A, 1B, 1C, 1D) provided around the substrate (W), plural tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) configured to supply polishing tapes (23A, 23B, 23C) to the plural polishing head assemblies (1A, 1B, 1C, 1D) and recover the polishing tapes (23A, 23B, 23C) from the plural polishing head assemblies (1A, 1B, 1C, 1D), and plural moving mechanisms configured to move the plural polishing head assemblies (1A, 1B, 1C, 1D) in radial directions of the substrate (W) held by the rotary holding mechanism (3). The tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) are located outwardly of the plural polishing head assemblies (1A, 1B, 1C, 1D) in the radial directions of the substrate (W), and the tape supplying and recovering mechanisms (2A, 2B, 2C, 2D) are fixed in position.