Substrate connecting method

The present invention provides a substrate connecting method, which can place a substrate flatly on a carrying table, and release the adsorption of an electrostatic chuck to lift the substrate from the carrying table, therefore the substrate does not easily generate paradoxical discharge. The substrate connecting method comprises: a substrate carrying step of descending a first lift pin (8a) and a substrate (G) supported by a second lift pin (8b) which is lower than the first lift pin (8a) on the top of the substrate carrying surface (4c) to make the substrate be carried from the central part of the substrate to the substrate carrying surface (4c); a plasma process step for the substrate (G)of adsorbing the substrate carried on the substrate carrying surface (4c) by using the electrostatic chuck (41); and a substrate separation step of releasing the adsorption of the electrostatic chuck (41) after plasma processing to make the first lifting pin (8a) and the second lifting pin (8b) at a same height to carry the substrate (G) and to detach the substrate (G) from the substrate carrying surface (4c).