Flexible substrate module

Disclosed is a flexible substrate module that uses a flexible substrate and has sufficiently excellent heat dissipation properties against a mounted heat source, and sufficiently excellent flexibility and accumulation. The flexible substrate module (1) is configured such that a printed wiring layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AKAHANE YOSHIHIRO, OKUYAMA HIROSHI, SAITO HIROHISA, MATSUBARA HIDEKI, KITOU KAZUHIRO, MATSUMURA HIROYUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	Disclosed is a flexible substrate module that uses a flexible substrate and has sufficiently excellent heat dissipation properties against a mounted heat source, and sufficiently excellent flexibility and accumulation. The flexible substrate module (1) is configured such that a printed wiring layer (12) is formed as a surface layer laminated to the surface side of a flexible insulated base material (11), and a heat source (14) is mounted on the printed wiring layer (12); and is characterized by having, as rear surface layers that are laminated on to the rear surface side of the flexible insulated base material (11), a plurality of laminated thermal expansion promotion layers (21, 23) in the flexible substrate module (1) facing and attached to a casing (K) to which the module is to be attached, made from a highly heat conductive material and for promoting expansion, towards the casing (K) to which the module is to be attached, of the surface area of hot spots that are heat-transferred from the heat source (14)