Abrasive and substrate polishing method

The invention provides an abrasive for polishing cobalt-containing layers. The abrasive comprises a carboxylic acid derivative, a metal corrosion inhibitor and water, the carboxylic acid derivative consisting of at least one selected from a phthalic compound, an isophthalic compound, an alkyl dicarb...

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Bibliographische Detailangaben
Hauptverfasser:	MISHIMA KOUJI, TOBITA FUMIKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NATURAL RESINS NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	The invention provides an abrasive for polishing cobalt-containing layers. The abrasive comprises a carboxylic acid derivative, a metal corrosion inhibitor and water, the carboxylic acid derivative consisting of at least one selected from a phthalic compound, an isophthalic compound, an alkyl dicarboxylic compound represented by the formula (I), and salts and anhydrides of the phthalic compound, the isophthalic compound and the alkyl dicarboxylic compound. The pH is below 4.0. Formula (I): HOOC-R-COOH.