Manufacturing process improvement method for pluggable flexible printed circuit (FPC)

The invention relates to the field of FPC (flexible printed circuit) manufacturing, and relates to a manufacturing process improvement method for a pluggable FPC. The manufacturing process improvement method comprises the manufacturing steps of designing a circuit; forming the circuit; stamping a po...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZOU CHUNGUANG, ZOU PING
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to the field of FPC (flexible printed circuit) manufacturing, and relates to a manufacturing process improvement method for a pluggable FPC. The manufacturing process improvement method comprises the manufacturing steps of designing a circuit; forming the circuit; stamping a positioning target; carrying out surface processing and an electrical property test on the circuit; punching the shape of the circuit out; and carrying out detection on a finished product. The manufacturing process improvement method has improvements that in the circuit design, the edges of the shapes of a pluggable finger soldering pan and the FPC are in inward contraction design, a target center of a positioning design target of the pluggable finger soldering pan is stamped to be positioned on a same surface with the pluggable finger soldering pan, and more than two mould positioning holes are adjacent to the pluggable finger soldering pan; in the positioning target stamping, the target center of the positioning ta